Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

Job Description

Next Generation, High-Speed, Memory and Cache Controller and Advanced Memory NoCs based Subsystem Design Team is looking for a Senior ASIC Design Engineers for the next generation high speed HBM/LPDDR/DDR memory subsystems.. The front end of the DDR controller interfaces to the rest of the system such as CPU, GPU, DSP, Multimedia Processors and the engineer is expected to be responsible for enabling high speed (1Ghz+) designs in QCT products.

The candidate will work on architecture, design (RTL coding), and deployment of the next generation, high-speed memory subsystems into QCT products. You will develop or contribute to the development of architecture and design specifications and drive the micro-architecture of portions of the logic design. You will implement and deliver RTL and work with verification engineers to deliver high quality designs. You will be responsible for debugging your designs and also provide debug support when integrated into the rest of the chip. Synthesis, Timing Closure, Physical Design Support, Gate Level Simulations, Power Analysis are expected to be key tasks. You will make regular contributions to the overall improvement in design methodology to drive productivity and quality of results.

Qualifications

Bachelor's or Masters degree in Science, Engineering, or related field.

5 + years ASIC design, RTL coding, front-end digital design experience

3+ years Hardware Architecture experience

Preferred Qualifications

3-10 years of ASIC design (RTL coding) Preferred

Exposure to RTL Design Verification flows is a plus

3+ years of direct Hardware Architecture experience

Bachelors degree in Electrical or Computer Engineering and at least 5+ years of experience in high speed digital design Master's degree preferred

Experience with the following:

LPDDR memory and cache controller, NoC based architectures especially the front end interfacing to the CPU, DSP, and multimedia processors

Exposure to HBM memory type designs

On-chip tightly coupled SRAM & L3 cache controller architecture/design

Experience with x86 or ARM CPU/bus architectures

Ordering of memory transactions and methods to enforce proper ordering in order to conform to ISA architecture specification

Education Requirements

Required: Bachelor's, Computer Engineering and/or Electrical Engineering

Preferred: Master's, Computer Engineering and/or Electrical Engineering

Minimum Qualifications:

Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

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Pay range and Other Compensation & Benefits :

$140,000.00 - $210,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can re details about our US benefits at this link .

If you would like more information about this role, please contact Qualcomm Careers .