Die / Clip Attach Technical Expert

As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.

You will play a key role in driving equipment strategy, introducing advanced technologies, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.

This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.

What You Will Do

Equipment & Technology Strategy

Define and drive equipment strategies aligned with factory and package R&D roadmaps

Evaluate and select new equipment technologies for manufacturing processes

Lead equipment introduction and qualification projects

Process Improvement & Technical Leadership

Solve complex and chronic technical issues in manufacturing

Drive improvement projects to enhance productivity, process capability, quality, and cost efficiency

Develop and maintain process standards and design rules

Benchmarking & Best Practices

Conduct cross-site benchmarking activities

Implement best practices across manufacturing sites

Scout and evaluate state-of-the-art technologies and industry solutions

Project Management & Collaboration

Lead technical projects involving cross-functional and international teams

Prepare technical reports, capability studies, and roadmaps

Work closely with R&D, production, quality, and engineering teams

Industry & Market Awareness

Stay updated on the latest semiconductor equipment and process technologies

Build and maintain strong industry networks with suppliers and technology partners

What You Will Need

Bachelor’s or master’s degree in engineering or a related discipline

Minimum 10 years of experience in semiconductor manufacturing and process engineering

Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations

Proven experience in equipment selection, qualification, optimization, and technology introduction

Strong analytical thinking with excellent troubleshooting and problem-solving capabilities

Ability to work independently and drive improvement initiatives proactively

Strong communication and presentation skills with the ability to engage stakeholders effectively

Experience leading technical and cross-functional projects in a manufacturing environment

Strong leadership, influencing, and stakeholder management skills

Detail-oriented with a structured and systematic working approach

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.