Wire Bond Senior Equipment Sustaining Engineer

nexperia

Seremban, MYunknownPosted Jul 24, 2026
Posting intelligenceActively listed

At a glance

Why this role might suit you

The role offers sustained technical impact in semiconductor manufacturing with exposure to advanced wire bond equipment, continuous improvement initiatives, and collaboration across engineering functions, providing meaningful engagement for experienced sustaining engineers.

Skills

wire-bond-equipment-sustainingsemiconductor-equipmentpreventive-maintenanceroot-cause-analysisequipment-qualificationvalidationcontinuous-improvementspcfmeacapaasmkshesselean-six-sigmamesfactory-automationindustry-4-0npiequipment-upgradesautomation-projectsdata-analysisminitabjmp

About the role

About the Role

As a Senior Engineer – P3C Wire Bond (WB) Equipment Sustaining, you will be responsible for ensuring the stability, reliability, and performance of Wire Bond equipment within the P3C manufacturing area. You will provide technical support to production, drive equipment uptime, resolve equipment-related issues, and implement continuous improvement initiatives to achieve operational excellence.

What You Will Do

Sustain and maintain Wire Bond equipment to meet production, quality, and reliability targets.

Troubleshoot equipment failures and lead root cause analysis to prevent recurrence.

Drive preventive, predictive, and corrective maintenance activities to maximize equipment uptime.

Monitor and improve equipment performance metrics such as OEE, MTBF, and MTTR.

Support equipment qualification, validation, and release for production.

Work closely with Production, Process Engineering, Quality, and Maintenance teams to resolve technical issues.

Lead equipment performance improvement initiatives to enhance productivity and reduce downtime.

Collaborate with equipment suppliers on technical support, troubleshooting, and upgrades.

Prepare and maintain equipment procedures, documentation, and technical reports.

What You Will Need

Qualifications

Bachelor's Degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering discipline.

Minimum 5 years of experience in semiconductor equipment engineering.

Experience supporting Wire Bond equipment in a high-volume manufacturing environment.

Must Have

Hands-on experience in Wire Bond equipment sustaining and troubleshooting.

Strong knowledge of equipment maintenance and reliability engineering principles.

Experience with root cause analysis and problem-solving methodologies.

Knowledge of SPC, FMEA, 8D, CAPA, and continuous improvement tools.

Experience in equipment qualification, validation, and process support.

Good to Have

Experience with ASM, K&S (Kulicke & Soffa), or Hesse Wire Bond equipment.

Lean Six Sigma Green Belt certification.

Knowledge of MES, Factory Automation, or Industry 4.0 technologies.

Experience supporting NPI, equipment upgrades, or automation projects.

Data analysis skills using Minitab, JMP, or equivalent tools.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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