Package Thermal & Mechanical Simulation Engineer

The future starts here! Are you ready to join NXP in Package Innovation?

The Package Innovation organization is responsible for the design of new packaging concepts and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.

Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.

The Package Innovation Mechanical & Thermal Modelling team uses Finite Element and Finite Volume simulation methodologies. They are used to shorten development cycles and deliver optimized design solutions for semiconductor packages. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures containing many non-linearities.

To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Austin TX, USA. Your role is to develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming at a first-time right product qualification. A second key focus area will be to analyze the thermal performance of package concepts and technologies in modelized and actual applications.

Your responsibilities

Be a part of the on-site Package Innovation simulation team at NXP Austin and collaboratively solve engineering questions for package development projects.

Collaborate with product development teams and package project leads in support of risk mitigation and design optimization.

Support problem-solving of package related issues during lifetime testing.

Analyze thermal performance of products.

Your team

The modelling team’s responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in Austin. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.

Your profile

To be successful in this role you have:

A Master or Ph.D. degree qualified in Mechanical Engineering or equivalent is required

Experience with Finite Element Modelling, preferably with Ansys or Marc Mentat

Fluent in English

Understanding of semiconductor packaging technologies is preferred.

Willingness to be present on site for at least 3 days/week

Furthermore, you are:

An excellent communicator, teamplayer, influencer and networker.

A self-starter with initiative, flexibility and command skills.

More information about NXP in the United States...

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