PCB Designer

We are looking for an experienced PCB Designer to join our hardware engineering team. The ideal candidate will have hands-on expertise in Cadence Allegro and a strong track record of designing complex, high-speed multilayer boards involving DDR4 memory interfaces, microprocessors (MPU), and microcontrollers (MCU). You will work closely with hardware, signal integrity, and mechanical teams to deliver manufacturable, high-quality board designs.

Key Responsibilities:

Design multilayer PCB layouts (8+ layers) for embedded systems built around MPU and MCU platforms using Cadence Allegro.

Perform placement and routing of high-speed interfaces, with particular focus on DDR4 memory topologies (fly-by routing, length matching, byte-lane grouping, timing/skew constraints).

Define and manage constraint sets in Allegro Constraint Manager (impedance, differential pairs, min/max lengths, relative propagation delay).

Develop stack-up definitions in collaboration with fabrication vendors, ensuring controlled impedance and signal integrity requirements are met.

Work with hardware engineers on component placement, power delivery network (PDN) design, and decoupling strategies for high pin-count BGAs.

Implement design-for-manufacturing (DFM), design-for-assembly (DFA), and designfor-test (DFT) guidelines.

Perform BGA fanout and via optimization (via-in-pad, microvias, blind/buried vias as needed for HDI designs).

Coordinate with SI/PI engineers and incorporate simulation feedback into layout.

Generate and verify manufacturing outputs: Gerbers/ODB++, drill files, fab andassembly drawings, pick-and-place files, and BOM support.

Participate in design reviews and maintain layout documentation and library components (footprints, padstacks) per IPC standards.

Required Skills & Qualifications:

3–5 years of hands-on PCB layout experience.

Strong proficiency in Cadence Allegro PCB Editor (including Constraint Manager); experience with OrCAD/Allegro schematic flow is a plus.

Proven experience routing DDR4 memory interfaces, including length/skew matching, topology selection, and termination strategies.

Experience laying out boards based on MPUs (e.g., NXP i.MX, TI Sitara, ST MPU families) and MCUs (e.g., STM32, NXP, Renesas, Microchip).

Solid understanding of high-speed design principles: impedance control, crosstalk, return paths, EMI/EMC considerations.

Familiarity with fine-pitch BGA fanout, HDI technology, and multilayer stack-up design.

Knowledge of IPC standards (IPC-2221, IPC-7351, IPC-A-600).

Ability to read and interpret schematics, datasheets, and layout guidelines from silicon vendors.

Good communication skills and ability to work cross-functionally with hardware, mechanical, and manufacturing teams.

Preferred / Nice-to-Have:

Exposure to SI/PI simulation tools (e.g., Sigrity, HyperLynx).

Experience with other high-speed interfaces: PCIe, USB 3.x, Gigabit Ethernet, LVDS, MIPI.

Familiarity with flex/rigid-flex design.

Experience working directly with PCB fabrication and assembly houses.

Bachelor’s degree/Diploma in Electronics, Electrical Engineering, or related field.

What We Offer:

Opportunity to work on cutting-edge embedded hardware products.

Collaborative environment with experienced hardware and SI engineers.

Competitive salary and benefits. Professional growth and training opportunities.

Benefits:

Health insurance

Internet reimbursement

Provident Fund

Work Location: In person