Engineer Electrical 3

Date: Jul 22, 2026

Location: Syracuse, NY, New York, United States

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Company: HII's Mission Technologies division

Requisition Number: 29497

Required Travel: 0 - 10%

Employment Type: Full Time/Salaried/Exempt

Anticipated Salary Range: $90,486.00 - $145,000.00

Security Clearance: Ability to Obtain

Level of Experience: Mid

This opportunity resides with Warfare Systems (WS), a business group within HII’s Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems.

HII works within our nation’s intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity, network architecture, reverse engineering, software and hardware development uniquely enable us to support sensitive missions for the U.S. military and federal agency partners.

Leadership at HII – Mission Technologies

HII’s Leadership Capability Framework defines the standard of excellence expected of all leaders across Mission Technologies. Leaders are accountable for modeling these capabilities and building them within their teams:

Know & Grow Your People – Develop talent, empower teams, and build an inclusive environment.

Build Relationships – Strengthen trust, collaboration, and cross-functional partnerships.

Take Ownership – Drive accountability, execution excellence, and results.

Customer First – Anticipate mission needs and deliver value to our partners.

Shape the Future – Inspire innovation and align work with strategic priorities.

Act with Urgency – Make informed decisions and move with purpose.

These capabilities define how leaders inspire teams, deliver results, and shape the future of Mission

Job Description

Huntington Ingalls Industries – Mission Technologies division is seeking a highly skilled and motivated CCA Board Design Engineer 3 to join our growing engineering team. In this role, you will be responsible for the PCB design and layout of complex, high-reliability Circuit Card Assemblies (CCAs) and Printed Circuit Boards (PCBs) utilized in cutting-edge defense, national security, and electronic warfare systems.

As a Level 3 engineer, you will act as a technical lead on complex design tasks, collaborating closely with systems, mechanical, thermal, and software engineers to deliver robust hardware solutions from conceptual design through production.

Essential Job Responsibilities

Full Lifecycle Design: Lead layout design of complex multi-layer, high-speed digital, analog, and mixed-signal CCAs, as well as assist in schematic capture and documentation.

Technical Leadership: Guide junior engineers and design layout specialists through complex routing challenges, high-speed signaling constraints, and power distribution network (PDN) design.

DFx Optimization: Apply Design for Manufacturing (DFM), Design for Testing (DFT), and Design for Assembly (DFA) principles to ensure seamless transition from design to full-scale production.

Cross-Functional Collaboration: Partner with Mechanical and Thermal Engineers to ensure proper physical integration, structural integrity, and thermal dissipation of the CCAs within rugged environments.

Documentation: Generate comprehensive engineering documentation packages, including schematics, bills of materials (BOMs), fabrication drawings, and assembly instructions.

Minimum Qualifications

Education & Experience: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field with a minimum of 5 years of relevant experience; OR a Master’s degree with 3 years of relevant experience.

EDA Tool Proficiency: Demonstrated expert-level experience with industry-standard PCB design suites (e.g., Altium Designer, Siemens EDA/Mentor Graphics Xpedition, or Cadence Allegro).

Technical Expertise: Strong background in designing multi-layer boards utilizing high-density interconnect (HDI) microvias, controlled impedance, and fine-pitch BGA components.

Component Knowledge: Proven experience selecting components and designing circuits featuring FPGAs, processors, high-speed memory interfaces, and power management units (PMUs).

Preferred Requirements

Active Secret clearance.

Familiarity with aerospace/defense standards such as MIL-STD-810, IPC-2221/2222, and IPC-A-610.

Experience with RF/Microwave board layout and isolation techniques.

Familiarity with Altium Designer and Altium component and project databases

Experience utilizing simulation tools like HyperLynx, Ansys HFSS, or Keysight ADS for Signal Integrity and Power Integrity analysis.

Strong written and verbal communication skills, with the ability to present technical design reviews (PDR/CDR) to internal management and external clients.

The listed salary range for this role is intended as a good faith estimate based on the role's location, expectations, and responsibilities. When extending an offer, HII's Mission Technologies division takes a variety of factors into consideration which include, but are not limited to, the role's function and a candidate's education or training, work experience, and key skills.

Together we are working to ensure a future where everyone can be free and thrive.

Do You Need Assistance?

If you need a reasonable accommodation for any part of the employment process, please send an e-mail to buildyourcareer@hii-co.com and let us know the nature of your request and your contact information. Reasonable accommodations are considered on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will be responded to from this email address. Additionally, you may also call 1-844-849-8463 for assistance. Press #3 for HII Mission Technologies.