Optical Packaging/Component Engineer

Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)

About the role:

Develop and test packaging solutions for multi-lane optical interconnects.

Design and test optical sub-assemblies with arrays of optical fibers.

Design multi-fiber optical connectors and work with external vendors to develop connector eco-system.

Design micro-array assembly process, fixture and tooling development.

Work with optical fibers, optical launch optimization and optical loss testing.

Develop mechanical/optomechanical test procedures.

Perform micron level assembly techniques.

Measure material properties and interactions (e.g. epoxy selection, CTE, stress)

Component reliability and qualification testing.

Qualifications:

5+ years’ experience in Opto-Mechanical or Optical Packaging field.

M.S. degree or higher in Opto-Mechanical Engineering, Physics, or equivalent field.

Preferred experience with Optical Transceiver assembly, Silicon Photonics or Co-Packaged Optics

Hands-on expertise with mechanical design software (e.g. Solidworks) and mechanical modeling simulations

Experience with optical modelling software (e.g. Zemax, LightTools) is an asset

Knowledge of micro-replication techniques and polymer molding is an asset

Ability to work independently in a fast-paced startup environment

Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.