Senior IC Substrate Package Layout Designer

Responsibilities:

We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis, bump feasibility and package planning through substrate layout, SI/PI optimization, and manufacturing release. The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability, and Manufacturing teams to deliver high-performance package solutions for complex SoCs and multi-die products. You will focus on:

Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff

Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost

Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages

Collaborate closely with Backend, SI/PI, Thermal, Assembly, OSAT, and substrate vendors to resolve design and manufacturing challenges

Support package verification, design reviews, and tape-out activities while ensuring compliance with technology and assembly requirements

Qualifications:

Bachelor's or Master's degree in Electrical/Electronics Engineering or related field

4+ years of experience in IC package/substrate layout design

Expert-level proficiency in Cadence Allegro Package Designer (APD/APD XL), SiP Layout, and Constraint Manager

Strong understanding of substrate stackups, material selection, HDI technologies, via structures, package assembly processes, and reliability considerations

Working knowledge of Signal Integrity, Power Integrity, impedance control, differential routing, PDN design, return path optimization, and crosstalk management

Hands-on experience with high-speed interfaces including SerDes, PAM4, PCIe, DDR/LPDDR, HBM, Ethernet, CXL, USB, UCIe, and other multi-gigabit interfaces

Preferred Qualifications

Experience with AI/HPC, Networking, Data Center, or High-Performance Computing products

Knowledge of advanced packaging technologies such as Chiplets, Silicon Interposers, CoWoS, EMIB, and 3D Integration

Automation and scripting skills (Python, TCL, SKILL, or Perl)

Proven ability to lead complex package programs and mentor junior designers

The ideal candidate should be capable of independently driving package design from concept to production while balancing performance, manufacturability, reliability, and cost objectives.

Company Overview:

MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications.

We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the world’s most challenging communication technology problems in the most efficient and effective manner.

MaxLinear began by developing the world’s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn’t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, we’ve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, we’ve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intel’s Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers’ needs.

Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Valencia, Spain; Bangalore, India; Munich, Germany; Israel; and Singapore.

We have approximately 1,200 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market.