Tech Manager, PCB Engineering Service Team
Skills
About the role
Join NVIDIA as a Technical Manager, PCB Engineering Service Team within OPS Quick Turn PCB Engineering Service. We are seeking an experienced leader to build and scale a high-performing team that delivers complex PCB NPI programs from concept through production. In this role, you will implement efforts across advanced PCB development, supplier engagement, and cross-functional programs while advancing NVIDIA’s technical and operational capabilities.
What you will be doing:
Lead and develop a team of PCB NPI Program Managers to deliver advanced PCB builds on schedule, within cost targets, and to technical requirements.
Set team priorities and allocate resources effectively to support multiple concurrent NPI programs in a fast-paced, matrixed environment.
Drive cross-functional execution with Engineering, SI/PI, DFM, Quality, Operations, PCB/material suppliers, and other key partners.
Coordinate end-to-end PCB NPI readiness and delivery, including material readiness, DFM readiness, fabrication readiness, and final handoff to engineering teams.
Identify, escalate, and resolve complex risks related to technical issues, supply, capacity, cost, and schedule.
Establish metrics and operating reviews to track supply readiness, delivery performance, supplier execution, and overall program health.
Build scalable processes, playbooks, dashboards, and review mechanisms to improve predictability, execution quality, and efficiency.
Coach and mentor team members in technical depth, stakeholder management, and program leadership while strengthening succession planning and organizational capability.
What we need to see:
10+ overall years of experience in PCB NPI, technical program management, manufacturing operations, or related fields, including 5+ years in team leadership experience.
Bachelor’s degree or equivalent experience.
Proven leadership experience managing high-performing technical or program teams in complex, cross-functional environments.
Deep PCB technical knowledge, including stack-up, CCL, prepreg, HDI/HLC, DFM, impedance, and panel utilization.
Strong execution and influence skills, with the ability to align teams, drive decisions, and manage priorities across schedule, cost, and build risk.
Experience managing multiple concurrent programs, translating technical and operational data into clear actions and executive-level communication.
Excellent communication and stakeholder management skills, including presenting program status, trade-offs, and risks to senior leadership.
Experience with SAP PRD, PDP/Windchill, or similar ERP/PLM systems; strong English required, Mandarin strongly preferred for supplier and manufacturing collaboration in Taiwan, China, and SEA.
Ways to stand out from the crowd:
Experience leading PCB NPI teams supporting advanced compute, GPU, networking, or AI hardware platforms.
Proven track record of building and scaling technical organizations, developing talent, improving processes, and delivering measurable business outcomes.
Deep experience with HDI/HLC PCBs and complex multi-supplier execution models.
Experience defining operational metrics, dashboards, and automation to improve team performance, execution visibility, and planning efficiency.
Familiarity with SI, PI, and DFM concepts to effectively review and challenge supplier and build trade-offs.
Questions about this role
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