Direct Lid/Stiffener Attach Packaging Module Development Engineer

Job Details:

Job Description:

The position is for Package Module Development Engineer for direct lid/stiffener attach module as part of ATD (Assembly Technology Development) in Asia initiative. The candidate will define and establish process flow, conduct FMEA assessment, procedures, drawings review and equipment configuration for NPI products.

Selects and develops material and equipment (recipe, collaterals based on design rules) and drives improvement for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements over variables such as material, method, equipment, environment and operating personnel.

Plans and conduct experiments to fully characterize the process throughout the development cycle.

Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.

Candidate will also participate in pathfinding activities including new TIM (thermal interface material) qualification with regards to thermal performance, new failure mode characterization and resolution.

Establishes process control systems for the process module and sustains the module through volume ramp.

Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future.

Trains production/receiving process engineers for transfer to other virtual factories.

Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.

A successful candidate should also exhibit the following behavioral traits: Problem-solving, analytical, troubleshooting willingness and communication skills.

Qualifications:

Minimum Qualifications:

Bachelor / Master's degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field).

Involvement in research and development in assembly and packaging.

Knowledge in statistical design of experiments and problem-solving techniques.

Preferred Qualifications:

4 years+ experience preferred in process development and equipment engineering in semiconductor field.

Experience in lid/IHS (integrated heat spreader), stiffener attach and dispensing process.

Data science/statistical tools experience (JMP/SQL) and AI/ML knowledge is a plus.

Job Type: Experienced Hire

Shift: Shift 1 (Malaysia)

Primary Location: Malaysia, Kulim

Additional Locations:

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

Position of Trust N/A

Work Model for this Role This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.